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| KOA SPEER ELECTRONICS, INC. SS-228 R1 AHA 8/05/05 Three Termination Capacitor/Resistor EMI Filter for Signal Lines Type KCR 1. Features I I CERTIFIED CERTIFIED The KCR Series provides improved reduction of radiated noise and drives it into the ground. Capacitor/Resistor filter 2. Applications I Noise reduction in a variety of circuits 3. Ordering & Specifying Information Type designation shall be as the following form. KCR Type 1206 Size T Termination Material T: Sn TE Packaging TE: 7" Embossed Taping 2,000 pcs/reel 220/500 Capacitance/ Resistance 2 Significant digits + No. of zeros 1206 4. Dimension and Structure L W t e Glass Coating g GND Terminals (Ag + Ni, Sn Plating) e Terminals (Ag + Ni, Sn Plating) Size 1206 L W t g e .126.008 .063.008 .031.008 .039.012 .016.012 (0.40.3) (3.20.2) (1.60.2) (0.80.2)* (1.00.3) * KCR1206T221/500: t = .043 .008 (1.1 0.2) KCR1206T221/101: t = .043 .008 (1.1 0.2) 4.1 Circuit In Out GND Bolivar Drive I PAGE 1 OF 6 I P.O. Box 547 I Bradford, PA 16701 USA I 814-362-5536 I Fax 814-362-8883 I www.koaspeer.com Specifications given herein may be changed at any time without prior notice. Please confirm technical specifications before you order and/or use. KOA SPEER ELECTRONICS, INC. SS-228 R1 5. Ratings Ordering Code Capacitance Capacitance Resistance Resistance (pF) Tolerance () Tolerance (%) 22 22 47 47 100 100 220 220 +50 ~ -20 50 100 50 100 50 100 50 100 30 1/16 -40 ~ +85 Power Rating (W) Temp. Range (C) KCR1206T220/500 KCR1206T220/101 KCR1206T470/500 KCR1206T470/101 KCR1206T101/500 KCR1206T101/101 KCR1206T221/500 KCR1206T221/101 Customized parts are available upon request. 5.1 Rating Item Operating temperature range Storage temperature range Measuring condition (Standard) Temperature Relative humidity Measuring condition (Precision) Temperature Relative humidity Specification -40C ~ +85C -40C ~ +85C (After soldering) 15 ~ 35C 20 ~ 90% 20C 1C 60 ~ 67% PAGE 2 OF 6 Bolivar Drive I P.O. Box 547 I Bradford, PA 16701 I USA I 814-362-5536 I Fax 814-362-8883 I www.koaspeer.com Specifications given herein may be changed at any time without prior notice. Please confirm technical specifications before you order and/or use. KOA SPEER ELECTRONICS, INC. SS-228 R1 6. Characteristics Item Insulation Resistance Capacitance Requirement Min 1000M ohms Within the tolerance Conditions Applied rated voltage for 60 seconds. Frequency: 1kHz Voltage: 1Vrms DC: 0.3V Max. Solder a chip to a test substrate and then laterally apply a load (5N, 500gF) in the arrow direction. Chip DC Resistance Terminal Adhesion Strength Within the tolerance No physical damage Substrate Soldering Heat Resistance Appearance: No physical damage Capacitance: Within tolerance Dielectric Loss: Within tolerance Insulation Resistance: Within tolerance Flux: 25% rosin Pre-heating: 60 sec Pre-heating Temp: 150C Solder: H60A Solder Temp: 260C 5C Dip Time: 5 0.5 sec Flux: 25% rosin Pre-heating: 60 sec Pre-heating Temp: 150C Solder: H60A Solder Temp: 230C 5C Dip Time: 4 1 sec Repeat the following heat cycle 10 times: Step Temperature Time 1 -40C 3C 30 min 3 min 2 Room Temp. 15 min max. 3 85C 2C 30 min 3 min 4 Room Temp. 15 min max. Temp: 70C 2C Bias: 150% of rated voltage Test Time: 1000+48/-0 hour Solderablility More than 95% of the terminal electrode shall be covered with new solder. Temperature Cycle Appearance: No physical damage Capacitance: Within tolerance Dielectric Loss: Within tolerance Insulation Resistance: Within tolerance High Temperature Resistance Appearance: No physical damage Capacitance: Within tolerance Dielectric Loss: Within tolerance Insulation Resistance: Within tolerance Appearance: No physical damage Capacitance: Within tolerance Dielectric Loss: Within tolerance Insulation Resistance: Within tolerance Humidity Resistance (unload) Temp: 85C 2C Humidity: 85% 5% Test Time: 500+24/-0 hour PAGE 3 OF 6 Bolivar Drive I P.O. Box 547 I Bradford, PA 16701 I USA I 814-362-5536 I Fax 814-362-8883 I www.koaspeer.com Specifications given herein may be changed at any time without prior notice. Please confirm technical specifications before you order and/or use. KOA SPEER ELECTRONICS, INC. SS-228 R1 6. Characteristics Cont. Item Vending Substrate Requirement Appearance: No physical damage Capacitance: Within tolerance Conditions After soldering a chip to a test substrate, bend the substrate by 1 mm and then measure. The substrate is 20 GE4 or based Substrate Weight on GE4. Displacement 45 2 45 2 Humidity Resistance (load) Appearance: No physical damage Capacitance: Within tolerance Dielectric Loss: Within tolerance Insulation Resistance: Within tolerance Appearance: No physical damage Capacitance: Within tolerance Dielectric Loss: Within tolerance Insulation Resistance: Within tolerance Appearance: No physical damage Capacitance: Within tolerance Dielectric Loss: Within tolerance Insulation Resistance: Within tolerance Temp: 40C 2C Humidity: 90 - 95% Bias: 100% of rated voltage Test Time: 500+24/-0 hour Temp: -40C 2C Test Time: 1000+48/-0 hour Low Temperature Resistance (unload) Vibration The frequency of applied vibratoin should be swept from 10 Hz to 55 Hz and return to 10 Hz. This cycle time should be about 1 min and thiscycle should be repeated. Amplitude (total Excursion): 1.5 mm This motion shall be applied for period of 2 hours in each 3 mutually perpendicular axes. (total of 6 hours) After Temperature cycle test, High temperature resistance test, Humidity resistance test or Low temperature resistance test, the tested sample should be measured after having left in temperature from 15 to 35C and relative humidity from 45% to 75% for 24 hours. 7. Packaging Specifications 7.1 Taping Packaging of components on continuous tape is complete with carrier tape for putting components and cover tape for sealing. (1) Dimensions of Carrier Tape 15.75 (400) 6.30 (160) 6.30 (160) Top tape Empty Empty Tape running direction PAGE 4 OF 6 I Bolivar Drive I P.O. Box 547 I Bradford, PA 16701 I USA I 814-362-5536 I Fax 814-362-8883 www.koaspeer.com Specifications given herein may be changed at any time without prior notice. Please confirm technical specifications before you order and/or use. KOA SPEER ELECTRONICS, INC. SS-228 R1 (1) Dimensions of Carrier Tape Cont. t1 Feeding Hole Chip Pocket D0 E F B W t2 A Chip Component P1 P2 P3 Dimensions in inches (mm) Series A B W F E P1 KCR1206 0.078 0.003 0.137 0.003 0.314 0.011 0.137 0.02 0.068 0.003 0.157 0.003 (2.0 0.1) (3.5 0.1) (8.0 0.3) (3.5 0.05) (1.75 0.1) (4.0 0.1) Dimensions in inches (mm) Series P2 P3 KCR1206 0.078 0.02 0.157 0.003 (2.0 0.05) (4.0 0.1) (2) Reel dimensions D0 + 0.059... 0.003 .... -0 + 0.1 ) (1.5 -0 t1 0.011 0.001 (0.3 0.05) t2 0.098 (2.5 max) .079 (2.00.5) A oD oB Embossed cavity oC Embossed carrier W Dimensions in inches (mm) A Series 7.00 0.78 (178 2) B 2.36 (60 min) C 0.511 0.02 (13 0.5) D 0.83 0.03 (21 0.8) E 0.079 0.02 (2 0.5) W (min) 0.311 0.059 (7.9 1.5) W (max) 0.429 0.059 (10.9 1.5) PAGE 5 OF 6 Bolivar Drive I P.O. Box 547 I Bradford, PA 16701 I USA I 814-362-5536 I Fax 814-362-8883 I www.koaspeer.com Specifications given herein may be changed at any time without prior notice. Please confirm technical specifications before you order and/or use. KOA SPEER ELECTRONICS, INC. SS-228 R1 8. General Information (1) Storage The products must be stored from 10 to 35C and from 30% to 70% RH before soldering. (2) Soldering In general, ceramics are very sensitive to thermal shocks. Therefore the parts shall not be exposed to a sudden temperature increase, decrease or partial heating. Products shall be pre-heated prior to soldering. The temperature difference between the solder temperature and product temperature does not exceed 130C. It is desirable that the soldering temperature be kept 240 - 250C and that soldering time be less than 4 seconds. Flux shall be rosin type. Do not use strong acid type flux. The tip of the soldering iron shall be 20 W or less, 3 or less, and 220 - 250 C. Recommended soldering thermal and time conditions are shown in the Recommend Soldering Conditions. (3) Mounting After mounting components on the printed circuit board, do not apply stress through board bending or mishandling. (4) Pattern design The land pattern is recommended as follows. Chip Mounting Side Through Hole 9. Recommended Soldering Conditions Recommended Condition for Reflow Soldering Preheat 180 Seconds Max. 250C Soldering 10 Seconds Max. Natural Cooling 120 Seconds Min. 230C - 250C 150C Recommended Condition for Flow Soldering Preheat 120 Seconds Max. 250C Soldering 3-4 Seconds Max. Natural Cooling 120 Seconds Min. 150C 230C - 250C Recommended Condition for Iron Soldering Preheat 120 Seconds Max. 250C Soldering 4 Seconds Max. Natural Cooling Back Side Connect to ground pattern of mounting side 120 Seconds Min. Ground Pattern Resist 150C 220C - 250C (unit: mm) Bolivar Drive I PAGE 6 OF 6 I P.O. Box 547 I Bradford, PA 16701 I USA 814-362-5536 I Fax 814-362-8883 I www.koaspeer.com Specifications given herein may be changed at any time without prior notice. Please confirm technical specifications before you order and/or use. |
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